The Qualcomm Snapdragon 660 SoC is the chip to beat in the mid-range segment currently, but we’re soon going to see its successor up the ante for affordable phones to really high levels. Today, some interesting tidbits of the Qualcomm Snapdragon 670 chip have leaked out via WinFuture.
If the source is to be believed we can expect mid-range phones with the chip to deliver flagship-grade performance soon. It will reportedly be built on the 10nm process with big.LITTLE architecture. The chip will depart from the previous quad-core conservative cores + quad-core performance cores to a hexa-core + dual core structure. Here, the dual cores will be tasked to do the heavy lifting, according to info. It is also said to feature the Adreno 615 GPU that can clock up to 650 MHz.
Moreover, the Snapdragon 670 SoC supports WQHD (2560 × 1440p) resolution for mid-range phones. We already know 5G will be a thing in 2019 so Qualcomm is set to throw in X2X modem that will support 1 Gbps speeds. Additionally, the chip also known as the SDM670 will come with UFS 2.1 and eMMC 5.1.
Coming back to the processor speed, the hexa-core Kryo 300 Silver cluster will reach up to 2.6GHz. Compare this to the Snapdragon 845 performance cores that clock 2.8GHz and there is very little difference between the two. The dual-core Kryo 300 Gold cluster will deliver a maximum of 1.7GHz. Further, the entire chip comes with 1MB of L3 cache.
As for the camera, there isn’t adequate detail but the reference design points to a 13MP + 23MP sensor capacity. It is being said that Qualcomm might introduce the chip at MWC 2018 but nothing is set in stone right now. However, we should see smartphones with this potent SoC by the end of 2018 for sure.